Electronics Identification Labels

Polyimide (PI) is the usual answer for sustained high-temperature environments, because its service range sits well above paper and film-based PVC labels. We confirm the construction against your actual process temperature and dwell time rather than quoting a single number. Send the temperature profile and we specify the build.

ESD-safe labelling is available as an option on electronics applications. The requirement shows up in the surface resistance of the label itself, so we confirm the construction and the resulting specification before you commit. Tell us if it must be part of your incoming inspection criteria.

It depends on where in the process the label is applied. Labels applied before thermal exposure need a construction that survives that step; labels applied after do not. We map your process sequence first, then specify the label and adhesive so the print stays legible at the point where your operators read it.

Smooth and low-surface-energy surfaces are harder to bond to than textured ones, because the adhesive has less to grip. We match the adhesive and any surface treatment to the specific material you apply to. Send the substrate — bare metal, coated metal, plastic — and we confirm the specification.

Small labels are set on a release liner that suits your applicator, and we check the label dimensions against the component footprint so placement stays repeatable. Share the component size, the applicator type and any registration requirements and we confirm the format.